SmartFinger^® Film Substrate and Package Configuration

Rear side of the SmartFinger® Film showing the
ASIC, ESD protection and integrated passive
components

The SmartFinger^® Film sensor module is a complete micro system including a passive Sensor Substrate, an Application Specific Integrated Circuit (ASIC), Electrostatic Discharge (ESD) protection and optionally passive components for power supply decoupling.

The SmartFinger^® ASIC supports sensing arrays with up to 256 imaging channels.

The ultra-thin sensor can be flush mounted on any flat, recessed, or curved surface, threaded through slots in a cover, or folded over an edge.

For card applications it can be laminated between other inlays or films.

The polyimide material is semitransparent with an orange luster and can be partially illuminated by LED’s from the rear.

The SmartFinger® Film sensor substrate config-
uration for ACF or ZIF connector interfaces

The sensor can be fashioned with cosmetic features in the alternating metal and dielectric layers; it is even possible to embed graphics such as logos and text. Using laser technology as the standard procedure to cut the sensor, any shape, form or mounting features are possible.

SmartFinger^® Film is similar to any other flex circuit or PCB with respect to assembly technology. It can be provided with Flip Chip or Wire Bond interfaces for ASIC’s and µControllers, standard SMT footprints for soldering or bond pads for ACF.

Wide selections of system configurations are possible ranging from; sensor array only, to fully functional embedded fingerprint verification systems.